Diamond Dicing Blades for agate cutting diamond hacksaw blade for glass cutting cutting blade manufacturer from China More Super Hard Company Products Co., Ltd

Diamond Dicing Blades for agate cutting diamond hacksaw blade for glass cutting

Price:	0.1 USD
Payment Terms:	T/T,L/C
Place of Origin:	Henan, China (Mainland)


	Add to My Favorites
HiSupplier Escrow	Share \|

Product Detail

Model No.: cutting blade

Production Capacity: 4000/months

Delivery Date: 5-10days

Material: Diamond

Abrasive Grain Sizes: 120 240# 500#

Means of Transport: Ocean,Land,Air

Packing: carton box

Brand Name: More super hard

Usage: For Woodworking Tools

Workpiece: carbide teeth

Diamond Dicing Bladesr is used as the bonding agent material to realize strong holding powder. As a result, these diamond diblades have low blade wear

Diamond Dicing Blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed dicing blade	Features: Easy to handle ultra-thin blade; Blade dicing after laser grooving; Variety of different grit concentrations; Shows stable processing performance in high load processing	Hub dicing blade
Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
resin dicing blade	Features: High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials	Hubless dicing blade
Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter
metal dicing balde	Features: High rigidityminimized wavy and slant cutti g ; Able to control diamond concentration to achieve cutting quality ;Excellent rigidit and cut quality
Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,
Electroformed dicing balde	Features: Wide selection of blade options; Proprietary thin-blade technology ;Blade thickness - 0.0 15 mm to 0.3 mm; Available for both dicing saws and slicers
Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customers requirements

Electroformed dicing

blade

Features:

Easy to handle ultra-thin blade; Blade dicing

after laser grooving; Variety of different grit

concentrations; Shows stable processing

performance in high load processing

Hub dicing blade

Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

resin dicing blade

Features:

High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials

Hubless dicing

blade

Application:

Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

metal dicing balde

Features:

High rigidityminimized wavy and slant cutti

g ; Able to control diamond concentration to

achieve cutting quality ;Excellent rigidit and

cut quality

Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,

Electroformed dicing